Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163791 | Semiconductor device | Shuuichi Kariyazaki | 2018-12-25 |
| 10134648 | Manufacturing method of semiconductor device | Bunji Yasumura, Masanao Sato, Hiromi Abe | 2018-11-20 |
| 10128129 | Method of manufacturing semiconductor device | Hiromi Shigihara, Kei Yajima | 2018-11-13 |
| 9911673 | Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area | Bunji Yasumura, Masanao Sato, Hiromi Abe | 2018-03-06 |