Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134648 | Manufacturing method of semiconductor device | Toshihiko Akiba, Bunji Yasumura, Masanao Sato | 2018-11-20 |
| 9911673 | Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area | Toshihiko Akiba, Bunji Yasumura, Masanao Sato | 2018-03-06 |