Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008316 | Inductor embedded in a package substrate | Siamak Fazelpour, Ryan David Lane | 2018-06-26 |
| 9871012 | Method and apparatus for routing die signals using external interconnects | Vaishnav Srinivas, Bernie Jord Yang, Michael Brunolli, David Ian West | 2018-01-16 |