Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008454 | Wafer level package with EMI shielding | — | 2018-06-26 |
| 9892989 | Wafer-level chip scale package with side protection | Wen-Hsuan Lin | 2018-02-13 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008454 | Wafer level package with EMI shielding | — | 2018-06-26 |
| 9892989 | Wafer-level chip scale package with side protection | Wen-Hsuan Lin | 2018-02-13 |