WL

Wen-Hsuan Lin

NB Nxp B.V.: 1 patents #132 of 384Top 35%
Overall (2018): #196,726 of 503,207Top 40%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9892989 Wafer-level chip scale package with side protection CHUNG-HSIUNG HO 2018-02-13