Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922922 | Microchip with cap layer for redistribution circuitry and method of manufacturing the same | Chi-Kuei Lee, Ying-Chih Kuo, Wei-Feng Lin | 2018-03-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922922 | Microchip with cap layer for redistribution circuitry and method of manufacturing the same | Chi-Kuei Lee, Ying-Chih Kuo, Wei-Feng Lin | 2018-03-20 |