Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020335 | Short-resistant chip-scale package | Wei-Chih Chien | 2018-07-10 |
| 9922922 | Microchip with cap layer for redistribution circuitry and method of manufacturing the same | Chi-Kuei Lee, Ying Chung, Wei-Feng Lin | 2018-03-20 |