Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153310 | Stacked-chip backside-illuminated SPAD sensor with high fill-factor | Bowei Zhang, Gang Chen, Dyson H. Tai, Duli Mao | 2018-12-11 |
| 10062722 | Stacked image sensor with shield bumps between interconnects | Sohei Manabe, Keiji Mabuchi, Takayuki Goto, Boyd Fowler, Eric A. G. Webster | 2018-08-28 |
| 9986192 | Through-semiconductor and through-dielectric isolation structure | Dyson H. Tai, Duli Mao, Gang Chen, Chih-Wei Hsiung | 2018-05-29 |
| 9966408 | Image sensor with inverted source follower | Duli Mao, Dajiang Yang, Gang Chen, Dyson H. Tai | 2018-05-08 |
| 9923009 | Image sensor with hybrid deep trench isolation | Chih-Wei Hsiung, Duli Mao, Gang Chen, Dyson H. Tai | 2018-03-20 |
| 9881963 | Horizontal avalanche photodiode | Gang Chen, Eric A. G. Webster, Duli Mao, Dyson H. Tai | 2018-01-30 |
| 9881964 | Image sensor with inverted source follower | Duli Mao, Dajiang Yang, Gang Chen, Dyson H. Tai | 2018-01-30 |