Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9986192 | Through-semiconductor and through-dielectric isolation structure | Duli Mao, Vincent Venezia, Gang Chen, Chih-Wei Hsiung | 2018-05-29 |
| 9923009 | Image sensor with hybrid deep trench isolation | Chih-Wei Hsiung, Duli Mao, Vincent Venezia, Gang Chen | 2018-03-20 |