Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147698 | Radio frequency (RF) devices | Michael E. Watts | 2018-12-04 |
| 10141182 | Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof | Jaynal A. Molla, Geoffrey Tucker | 2018-11-27 |
| 10109594 | Semiconductor device with an isolation structure coupled to a cover of the semiconductor device | Michael E. Watts, David F. Abdo | 2018-10-23 |
| 10104759 | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof | Elie A. Maalouf, Geoffrey Tucker | 2018-10-16 |
| 10074588 | Semiconductor devices with a thermally conductive layer and methods of their fabrication | Bruce M. Green, Darrell G. Hill, L. M. Mahalingam | 2018-09-11 |
| 9986646 | Packaged electronic devices with top terminations, and methods of manufacture thereof | Audel A. Sanchez, Fernando A. Santos, Jerry L. White | 2018-05-29 |
| 9984951 | Sintered multilayer heat sinks for microelectronic packages and methods for the production thereof | — | 2018-05-29 |
| 9941210 | Semiconductor devices with protruding conductive vias and methods of making such devices | Jaynal A. Molla, Mali Mahalingam, Colby Greg Rampley | 2018-04-10 |
| 9922894 | Air cavity packages and methods for the production thereof | Jaynal A. Molla, David F. Abdo, Mali Mahalingam, Carl E. D'Acosta | 2018-03-20 |
| 9875987 | Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices | Jaynal A. Molla | 2018-01-23 |