Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014262 | Method of wafer dicing for backside metallization | L. Scott Klingbeil | 2018-07-03 |
| 9941210 | Semiconductor devices with protruding conductive vias and methods of making such devices | Lakshminarayan Viswanathan, Jaynal A. Molla, Mali Mahalingam | 2018-04-10 |