Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109564 | Wafer level chip scale semiconductor package | Roelf Anco Jacob Groenhuis, Leo van Gemert, Jan Gulpen | 2018-10-23 |
| 9953903 | Heatsink very-thin quad flat no-leads (HVQFN) package | Leonardus Antonius Elisabeth van Gemert, Rintje van der Meulen, Emil Casey Israel | 2018-04-24 |