Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109564 | Wafer level chip scale semiconductor package | Roelf Anco Jacob Groenhuis, Tonny Kamphuis, Jan Gulpen | 2018-10-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109564 | Wafer level chip scale semiconductor package | Roelf Anco Jacob Groenhuis, Tonny Kamphuis, Jan Gulpen | 2018-10-23 |