Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10053792 | Plating cup with contoured cup bottom | Jingbin Feng, Shantinath Ghongadi, Frederick Dean Wilmot | 2018-08-21 |
| 10023970 | Dynamic current distribution control apparatus and method for wafer electroplating | David W. Porter, Jonathan D. Reid, Frederick Dean Wilmot | 2018-07-17 |
| 10011917 | Control of current density in an electroplating apparatus | Ashwin Ramesh, Shantinath Ghongadi | 2018-07-03 |
| 9909228 | Method and apparatus for dynamic current distribution control during electroplating | — | 2018-03-06 |