Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10053792 | Plating cup with contoured cup bottom | Zhian He, Jingbin Feng, Frederick Dean Wilmot | 2018-08-21 |
| 10011917 | Control of current density in an electroplating apparatus | Zhian He, Ashwin Ramesh | 2018-07-03 |
| 9988734 | Lipseals and contact elements for semiconductor electroplating apparatuses | Jingbin Feng, Robert Marshall Stowell, Ashwin Ramesh | 2018-06-05 |