Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037970 | Multiple interconnections between die | James S. Golab, Trent S. Uehling, Tingdong Zhou | 2018-07-31 |
| 9974174 | Package to board interconnect structure with built-in reference plane structure | Robert J. Wenzel, Tingdong Zhou | 2018-05-15 |