Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147654 | Package materials monitor and method therefor | Stanley Andrew Cejka | 2018-12-04 |
| 10080285 | Electronic module power supply | Michael A. Christo, Julio A. Maldonado, Roger D. Weekly | 2018-09-18 |
| 10037970 | Multiple interconnections between die | David Clegg, James S. Golab, Trent S. Uehling | 2018-07-31 |
| 9972566 | Interconnect array pattern with a 3:1 signal-to-ground ratio | Zhaoqing Chen, Matteo Cocchini, Rohan U. Mandrekar | 2018-05-15 |
| 9974174 | Package to board interconnect structure with built-in reference plane structure | Robert J. Wenzel, David Clegg | 2018-05-15 |