Issued Patents 2018
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10149662 | 3D mechanical probe | Shengli Tang, Leyun Bai, Zhenchang Wang | 2018-12-11 |
| 10148859 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2018-12-04 |
| 10136041 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-11-20 |
| 10123776 | Ultrasonic probe, connection component for array elements and ultrasonic imaging system thereof | Ming Tang | 2018-11-13 |
| 10129452 | Camera module and array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Nan Guo, Takehiko Tanaka | 2018-11-13 |
| 10129451 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-11-13 |
| 10126519 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2018-11-13 |
| 10110791 | Camera module and array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Nan Guo, Takehiko Tanaka | 2018-10-23 |
| 10051167 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-08-14 |
| 10033913 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2018-07-24 |
| 9998644 | Camera module and molded circuit board assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-06-12 |
| 9992397 | Camera module and molded circuit board assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-06-05 |
| 9955055 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2018-04-24 |
| 9906700 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2018-02-27 |
| 9900487 | Camera module and array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Nan Guo, Takehiko Tanaka | 2018-02-20 |
| 9894772 | Manufacturing method of molded photosensitive assembly for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2018-02-13 |