Issued Patents 2018
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10148859 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang +4 more | 2018-12-04 |
| 10136041 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-11-20 |
| 10129452 | Camera module and array camera module based on integral packaging technology | Bojie Zhao, Zhenyu Chen, Nan Guo, Takehiko Tanaka | 2018-11-13 |
| 10129451 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-11-13 |
| 10126519 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang +4 more | 2018-11-13 |
| 10116843 | Electrical bracket and circuit conducting method for camera module | Baozhong ZHANG, Nan Guo, Zhen Huang, Feifan Chen, Yinhuan Wang +1 more | 2018-10-30 |
| 10110791 | Camera module and array camera module based on integral packaging technology | Bojie Zhao, Zhenyu Chen, Nan Guo, Takehiko Tanaka | 2018-10-23 |
| 10084949 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding +1 more | 2018-09-25 |
| 10051167 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-08-14 |
| 10033913 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang +4 more | 2018-07-24 |
| 9998644 | Camera module and molded circuit board assembly and manufacturing method thereof | Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-06-12 |
| 9992397 | Camera module and molded circuit board assembly and manufacturing method thereof | Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-06-05 |
| 9955055 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Bojie Zhao, Zhenyu Chen, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2018-04-24 |
| 9906700 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang +4 more | 2018-02-27 |
| 9900487 | Camera module and array camera module based on integral packaging technology | Bojie Zhao, Zhenyu Chen, Nan Guo, Takehiko Tanaka | 2018-02-20 |
| 9894772 | Manufacturing method of molded photosensitive assembly for electronic device | Bojie Zhao, Zhenyu Chen, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2018-02-13 |
| 9876949 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding +1 more | 2018-01-23 |
| 9876948 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding +1 more | 2018-01-23 |