Issued Patents 2018
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141275 | Method for manufacturing a semiconductor structure | — | 2018-11-27 |
| 10103114 | Semiconductor structure and manufacturing method thereof | — | 2018-10-16 |
| 10076034 | Electronic structure | — | 2018-09-11 |
| 10068865 | Combing bump structure and manufacturing method thereof | Chin-Lung Chu | 2018-09-04 |
| 10068822 | Semiconductor package and method for forming the same | — | 2018-09-04 |
| 10050021 | Die device, semiconductor device and method for making the same | Chin-Lung Chu | 2018-08-14 |
| 10037937 | Method for forming semiconductor package | — | 2018-07-31 |
| 9991215 | Semiconductor structure with through substrate via and manufacturing method thereof | — | 2018-06-05 |
| 9984987 | Semiconductor structure and manufacturing method thereof | — | 2018-05-29 |
| 9984995 | Semiconductor package and manufacturing method thereof | — | 2018-05-29 |
| 9966363 | Semiconductor apparatus and method for preparing the same | Chin-Lung Chu | 2018-05-08 |
| 9960146 | Semiconductor structure and method for forming the same | — | 2018-05-01 |
| 9935071 | Semiconductor package with lateral bump structure | Chin-Lung Chu | 2018-04-03 |
| 9922920 | Semiconductor package and method for fabricating the same | — | 2018-03-20 |
| 9905549 | Semiconductor apparatus and method for preparing the same | Chin-Lung Chu | 2018-02-27 |
| 9897133 | Carbon fiber washer | Yi-Ching Cheng, Chun-Han Lai, Po-Chen Sung, Chang-Mou Wu, Wen-You Lai | 2018-02-20 |
| 9893037 | Multi-chip semiconductor package, vertically-stacked devices and manufacturing thereof | Chin-Lung Chu | 2018-02-13 |
| 9893035 | Stacked package structure and manufacturing method thereof | — | 2018-02-13 |
| 9892985 | Semiconductor device and method for manufacturing the same | — | 2018-02-13 |
| 9881867 | Conductive connection structure having stress buffer layer | — | 2018-01-30 |