Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068865 | Combing bump structure and manufacturing method thereof | Po-Chun Lin | 2018-09-04 |
| 10050021 | Die device, semiconductor device and method for making the same | Po-Chun Lin | 2018-08-14 |
| 9966363 | Semiconductor apparatus and method for preparing the same | Po-Chun Lin | 2018-05-08 |
| 9935071 | Semiconductor package with lateral bump structure | Po-Chun Lin | 2018-04-03 |
| 9905549 | Semiconductor apparatus and method for preparing the same | Po-Chun Lin | 2018-02-27 |
| 9893037 | Multi-chip semiconductor package, vertically-stacked devices and manufacturing thereof | Po-Chun Lin | 2018-02-13 |