Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10111325 | Elastic conductor | — | 2018-10-23 |
| 10090268 | Method of forming solder bump, and solder bump | Hidekiyo Takaoka, Shigeo Nishimura, Minoru Ueshima, Tohru Kurushima | 2018-10-02 |