Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090268 | Method of forming solder bump, and solder bump | Yasuyuki Sekimoto, Shigeo Nishimura, Minoru Ueshima, Tohru Kurushima | 2018-10-02 |
| 10050355 | Conductive material, bonding method using the same, and bonded structure | Kosuke Nakano | 2018-08-14 |
| 10010980 | Solder paste, joining method using the same and joined structure | Kosuke Nakano | 2018-07-03 |