Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103035 | Copper-ceramic bonded body and power module substrate | Nobuyuki Terasaki | 2018-10-16 |
| 10016956 | Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate | Nobuyuki Terasaki | 2018-07-10 |
| 10011093 | Bonding structure of aluminum member and copper member | Nobuyuki Terasaki | 2018-07-03 |
| 9968012 | Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate | Nobuyuki Terasaki, Yoshirou Kuromitsu | 2018-05-08 |
| 9966353 | Power module substrate, method of producing same, and power module | Shuji Nishimoto | 2018-05-08 |
| 9953944 | Power module | Toyo Ohashi | 2018-04-24 |
| 9941235 | Power module substrate with Ag underlayer and power module | Shuji Nishimoto | 2018-04-10 |
| 9905437 | Method of producing bonded body and method of producing power module substrate | Nobuyuki Terasaki | 2018-02-27 |