Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103035 | Copper-ceramic bonded body and power module substrate | Yoshiyuki Nagatomo | 2018-10-16 |
| 10016956 | Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate | Yoshiyuki Nagatomo | 2018-07-10 |
| 10011093 | Bonding structure of aluminum member and copper member | Yoshiyuki Nagatomo | 2018-07-03 |
| 9968012 | Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate | Yoshiyuki Nagatomo, Yoshirou Kuromitsu | 2018-05-08 |
| 9905437 | Method of producing bonded body and method of producing power module substrate | Yoshiyuki Nagatomo | 2018-02-27 |