Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10125289 | Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and process for producing layered semiconductor device | Masaya SUGIYAMA, Yasuhiro Kawase, Hideki Kiritani, Masanori Yamazaki | 2018-11-13 |
| 9960092 | Interlayer filler composition for three-dimensional integrated circuit | Yasuhiro Kawase, Tomohide Murase, Makoto Takahashi, Takayoshi Hirai, Iho Kamimura | 2018-05-01 |