Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960092 | Interlayer filler composition for three-dimensional integrated circuit | Makoto Ikemoto, Yasuhiro Kawase, Tomohide Murase, Makoto Takahashi, Takayoshi Hirai | 2018-05-01 |