Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074599 | Semiconductor dies with recesses, associated leadframes, and associated systems and methods | Chua Swee Kwang | 2018-09-11 |
| 10056359 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Suan Jeung Boon | 2018-08-21 |
| 9911696 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Suan Jeung Boon, Meow Koon Eng | 2018-03-06 |