Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056359 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Yong Poo Chia, Suan Jeung Boon | 2018-08-21 |
| 9911696 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Suan Jeung Boon, Yong Poo Chia | 2018-03-06 |