Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10053571 | Polymer emulsion having heat sealability for blister package and preparation method thereof | Su Jin Lee, Dae Won Cho, Sang Hyun Cho | 2018-08-21 |
| 9859847 | Parallel combined output linear amplifier and operating method thereof | Ji-seon Paek, Seung Chul Lee, Young-Hwan Choo, Sung Jun Lee, Jun Hee Jung +1 more | 2018-01-02 |