Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10053571 | Polymer emulsion having heat sealability for blister package and preparation method thereof | Su Jin Lee, Jeong Hyun Choi, Sang Hyun Cho | 2018-08-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10053571 | Polymer emulsion having heat sealability for blister package and preparation method thereof | Su Jin Lee, Jeong Hyun Choi, Sang Hyun Cho | 2018-08-21 |