Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9918377 | Heat dissipation approach in chip on board assembly by using stacked copper Microvias | Kyle Fukuchi, Melanie Beauchemin, Ryohei Urata | 2018-03-13 |
ZS
Zuowei Shen
Overall (2018): #172,682 of 503,207Top 35%
1
Patents 2018