Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9918377 | Heat dissipation approach in chip on board assembly by using stacked copper Microvias | Zuowei Shen, Kyle Fukuchi, Ryohei Urata | 2018-03-13 |
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Melanie Beauchemin
Overall (2018): #308,982 of 503,207Top 65%
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Patents 2018