Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984983 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai | 2018-05-29 |
| 9960137 | Semiconductor device package and method for forming the same | Chun-Chin Huang, Che-Ming Hsu | 2018-05-01 |