Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984983 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Chi-Sheng Chung, Jin-Feng Yang, Chen-Yin Tai, Yung-I Yeh | 2018-05-29 |
| 9871005 | Semiconductor device package and method of manufacturing the same | I-Chia Lin, Chieh-Chen Fu, Cheng-Nan Lin | 2018-01-16 |