YL

Yung-Chi Liu

CT Chipbond Technology: 1 patents #2 of 7Top 30%
📍 New Taipei, TW: #629 of 1,960 inventorsTop 35%
Overall (2018): #177,931 of 503,207Top 40%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9929051 Wafer dicing method Chia-Jung Tu, Chih-Lung Chen, Wen-Hsiang Liao, Chung-Hsiang Wei 2018-03-27