Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9961759 | Flexible substrate | Chin-Tang Hsieh, Fei Wu | 2018-05-01 |
| 9929051 | Wafer dicing method | Chih-Lung Chen, Wen-Hsiang Liao, Chung-Hsiang Wei, Yung-Chi Liu | 2018-03-27 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9961759 | Flexible substrate | Chin-Tang Hsieh, Fei Wu | 2018-05-01 |
| 9929051 | Wafer dicing method | Chih-Lung Chen, Wen-Hsiang Liao, Chung-Hsiang Wei, Yung-Chi Liu | 2018-03-27 |