Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134664 | Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof | Minkyung Kang, Dong Ju Jeon, KyoungHee Park | 2018-11-20 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134664 | Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof | Minkyung Kang, Dong Ju Jeon, KyoungHee Park | 2018-11-20 |