Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115673 | Embedded substrate package structure | Sung-Lien He, Chun Yuan Hou, Hsi-Ying Yuan, Feng-Yi Chang | 2018-10-30 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115673 | Embedded substrate package structure | Sung-Lien He, Chun Yuan Hou, Hsi-Ying Yuan, Feng-Yi Chang | 2018-10-30 |