Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115673 | Embedded substrate package structure | Sung-Lien He, Chun Yuan Hou, Tung-Chuan Wang, Feng-Yi Chang | 2018-10-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115673 | Embedded substrate package structure | Sung-Lien He, Chun Yuan Hou, Tung-Chuan Wang, Feng-Yi Chang | 2018-10-30 |