Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083894 | Integrated die paddle structures for bottom terminated components | Mark J. Jeanson, Matthew S. Kelly | 2018-09-25 |
| 10073134 | Laminate bond strength detection | Theron Lee Lewis | 2018-09-11 |
| 10048312 | Testing printed circuit board assembly | Mark K. Hoffmeyer, Mark J. Jeanson, Matthew S. Kelly | 2018-08-14 |
| 9986649 | Increasing solder hole-fill in a printed circuit board assembly | Matthew S. Kelly | 2018-05-29 |
| 9910085 | Laminate bond strength detection | Theron Lee Lewis | 2018-03-06 |