MH

Mark K. Hoffmeyer

IBM: 3 patents #2,236 of 10,623Top 25%
Overall (2018): #65,840 of 503,207Top 15%
3
Patents 2018

Issued Patents 2018

Patent #TitleCo-InventorsDate
10111322 Implementing reworkable strain relief packaging structure for electronic component interconnects 2018-10-23
10048312 Testing printed circuit board assembly Stephen M. Hugo, Mark J. Jeanson, Matthew S. Kelly 2018-08-14
9913361 Integrated circuit device assembly David Barron, Jason R. Eagle, Roger Duane Hamilton, Christopher W. Mann, Matthew T. Richardson 2018-03-06