Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141284 | Method of bonding semiconductor substrates | Lan Peng, Patrick Verdonck, Robert C. Miller, Gerald Beyer, Eric Beyne | 2018-11-27 |
| 10033110 | Multi-band, multi-polarized wireless communication antenna | Young-Chan Moon, Sung Hwan SO, Jae Hwan Lim, Seong-Ha Lee | 2018-07-24 |