Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128168 | Integrated circuit device including through-silicon via structure and method of manufacturing the same | Ju-Il Choi, Kun-Sang Park, Ji-Soon Park, Byung-Lyul Park | 2018-11-13 |