Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10034393 | Implementing high-speed signaling via dedicated printed circuit-board media | Douglas A. Baska, Daniel M. Dreps, Roger D. Weekly | 2018-07-24 |
| 9972566 | Interconnect array pattern with a 3:1 signal-to-ground ratio | Zhaoqing Chen, Matteo Cocchini, Tingdong Zhou | 2018-05-15 |