Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10150667 | Panel level packaging for MEMS application | Yaoling Pan | 2018-12-11 |
| 9929097 | Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers | Ravi Kiran Nalla, Houssam Jomaa | 2018-03-27 |