Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163834 | Chip package structure comprising encapsulant having concave surface | Li-Chih Fang, Hung-Hsin Hsu, Shang-Yu Chang Chien | 2018-12-25 |
| 10157828 | Chip package structure with conductive pillar and a manufacturing method thereof | Hung-Hsin Hsu | 2018-12-18 |
| 10141276 | Semiconductor package structure and manufacturing method thereof | Hung-Hsin Hsu, Shang-Yu Chang Chien | 2018-11-27 |
| 10079218 | Test method for a redistribution layer | Han-Wen Lin, Hung-Hsin Hsu, Shang-Yu Chang-Chien | 2018-09-18 |
| 10002848 | Test method for a redistribution layer | Han-Wen Lin, Hung-Hsin Hsu, Shang-Yu Chang-Chien | 2018-06-19 |
| 9927548 | Apparatus for well logging capable of forward investigation | Jinzhou Yang, Zuohui Li, Baojun Wei, Qinglong Liu, Hongbing Xiao | 2018-03-27 |