Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9985004 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | R. Scott West, Tao Tong, Mike Kwon | 2018-05-29 |
| 9893039 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | R. Scott West, Tao Tong, Mike Kwon | 2018-02-13 |