Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9985004 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | Tao Tong, Mike Kwon, Michael Solomensky | 2018-05-29 |
| 9893039 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | Tao Tong, Mike Kwon, Michael Solomensky | 2018-02-13 |
| 9893243 | LED-based light source utilizing asymmetric conductors | Yan Chai | 2018-02-13 |