Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103076 | Semiconductor package including a semiconductor die having redistributed pads | Mark Pavier, Andrew N. Sawle | 2018-10-16 |
| 10074616 | Chip protection envelope and method | — | 2018-09-11 |
| 10064287 | System and method of providing a semiconductor carrier and redistribution structure | Andrew Roberts | 2018-08-28 |
| 10032688 | Electronic component and method for dissipating heat from a semiconductor die | Marcus Pawley | 2018-07-24 |
| 9978719 | Electronic component, arrangement and method | — | 2018-05-22 |
| 9974187 | Power in lead | Andrew Roberts, Milko Paolucci | 2018-05-15 |
| 9917024 | Electronic component and method for electrically coupling a semiconductor die to a contact pad | Marcus Pawley | 2018-03-13 |
| 9867277 | High performance vertical interconnection | Andrew Roberts | 2018-01-09 |